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Low distortion cold rolled clad sheets for PWB

机译:低失真冷轧包层PWB

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摘要

New cladding process has been developed by means of a surface activated bonding (SAB) technique. In this process, surfaces of materials to be bonded are cleaned, activated by Ar ion sputter etching, and rolled with low distortion at room temperature in vacuum. This is available for cladding not only between heterogeneous metals but also between metal and polymer film. The clad sheets manufactured by this process have advantages over conventional clad sheets. For instance, they have a clean and flat interface without alloy layer. In addition, thickness of each layer is constant, even thin metal foil can be bonded with the metal foil or polymer film. In such respects the clad sheets with those features have been applied to PWB. Metal/metal clad sheets are suitable for selective wet etching working. The developed Cu/Ni/Cu 3-layer clad material makes it possible to form the 3D structure, containing the bumps and circuits, only by means of wet etching process. Metal/polymer clad materials composed of very thin rolled Cu foil and LCP Liquid Crystalline Polymer) film, are superior to the conventional materials from the point of fine etching property and high frequency property because of their smooth bonding interface. This paper reports the features of clad sheets manufactured by SAB and their applications to PWB.
机译:通过表面激活粘合(SAB)技术开发了新的包层工艺。在该过程中,通过Ar离子溅射蚀刻来清洁待粘合的材料的表面,并在室温下在真空中以低变形滚动。这不仅可以在金属和聚合物膜之间覆盖而且不仅在异质金属之间包覆。通过该过程制造的包层板具有优于常规包层板的优点。例如,它们具有无需合金层的干净和平坦的界面。另外,每层的厚度是恒定的,甚至薄金属箔可以与金属箔或聚合物膜粘合。在这样的方面,具有这些特征的包层已应用于PWB。金属/金属包覆板适用于选择性湿法蚀刻工作。显影的Cu / Ni / Cu 3层包层材料使得可以通过湿法蚀刻工艺形成含有凸块和电路的3D结构。由非常薄的轧制Cu箔和LCP液晶聚合物组成的金属/聚合物包覆材料,由于其光滑的粘接界面,从精细蚀刻性能和高频性能优于常规材料。本文报道了由SAB制造的包层及其应用于PWB的特征。

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