integrated circuit packaging; application specific integrated circuits; random-access storage; flip-chip devices; reliability; next generation packaging; high performance ASICs; data rate; Internet router systems; high speed electrical performance; ASIC packaging; silicon integration; higher I/O density; thermal power dissipation; embedded SRAM; DRAM drives; die size; packaging substrate technology; bump pitch; package body size; package assembly; card level assembly; high availability telecommunication products; ASIC package; final product system level;
机译:研究使用SIP(系统级封装)技术进行ASIC /内存集成的可靠性问题的研究
机译:下一代硬件系统的光电多芯片模块封装技术和光输入/输出接口芯片级封装
机译:定制ASIC数字化仪的设计和性能,可用于65 nm CMOS技术的线室读出
机译:高性能ASIC的下一代封装技术
机译:下一代无线通信数据路径的ASIC中的功率性能折衷
机译:RANDSEQR:用于描述随机数生成任务的性能的R包
机译:PUF加密密钥生成ASIC的性能指标和经验结果