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Measurement of Diamond Abrasive Grain Temperature in Grinding using Infrared Radiation Pyrometer

机译:使用红外辐射高温计测量金刚石磨粒在研磨中的磨削

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The temperature of the diamond abrasive grain in single-point grinding was measured using a two-color pyrometer with an optical fiber. A conical, single-point diamond cutting tool was used as the cutting grain, and titanium and tungsten carbide were used as workpieces. Results show that the infrared rays radiated from the tool-workpiece interface and transmitted through the diamond tool were accepted by the optical fiber and led to infrared detectors with different spectral sensitivity. The tool tip temperature ranged from 400°C - 550°C on the titanium and 850°C - 1400°C on the tungsten carbide for cutting speeds ranging from 12.1m/s-24.3m/s.
机译:使用具有光纤的双色高温计测量单点研磨中的金刚石磨粒的温度。用作切割晶粒的圆锥形,单点金刚石切割工具,用钛和碳化钨用作工件。结果表明,从工具 - 工件界面辐射并通过金刚石工具透射的红外线被光纤接受,并导致具有不同光谱灵敏度的红外探测器。工具尖端温度在钛和850℃-1400℃的碳化钨上的400℃-550°C范围为400℃-550℃,以切割速度为12.1m / s-24.3m / s。

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