The photonics industry is driving towards more cost effective and compact photonics packages. At the same time, increased performance in direct coupling applications has placed emphasis in high precision coupling and fiber retention. We have performed tests validating laser assisted solder reflow (laser solder) fiber attachment techniques in direct-coupled photonics device applications. A summary of these test results is presented. Coupled with other observations, these results lead to the conclusion that laser solder is a cost effective and otherwise superior assembly solution in direct coupling applications.
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