Modeling Fatigue Behavior of Electronically Conductive Filled Adhesive Joints Under Cyclic Loading-A Novel Modeling Approach for Integrated Joint Life Prediction

摘要

This paper describes a novel fatigue-life prediction methodology aimed at providing a design engineer an easy fatigue life predictive tool using experimental data, for constant cyclic mechanical or thermal loading condition. Tins encompasses an integrated approach of joint testing, analysis, and analytical modeling. Utilizing the proposed methodologies, we aim to predict the changes in fatigue life of the adhesive, based on the whole spectrum of test variables including temperature, humidity, stress ratio, and frequency. This modeling approach will enable the design engineer to have an initial evaluation tool of the fatigue life of joints subjected to various detrimental fatigue conditions, eventually leading to a much improved fatigue life, improved fail-safe capability, and reduced manufacturing costs.