High Density Integrated Electromagnetic Power Passives with Vertical Interconnect and Stacked Structure

摘要

A stacked-cell structure to construct an integrated electromagnetic power passive (IEPP) module is presented in this paper. Copper is plated on dielectric substrate, such as ceramic strip to realize a so-called L-C-cell. The L-C-cells are stacked symmetrically and encapsulated inside a ferrite as a passive module. With the interconnections on the vertical surface, the module can achieve various energy transfer functions. The 1~(st) order approximation circuits of modules with specific interconnections are presented. The construction of interconnections is also discussed. The experimental results show the potential of IEPP as a high-density power passive module. Good correspondence between the first-order models and experimental measurements is demonstrated.