Status of third-generation focal plane array IR detection modules at AIM

摘要

The 3~(rd) generation of infrared (IR) detection modules is expected to provide video resolution or even more pixels and advanced functionality's like multicolor or multi band capability, higher frame rates and better thermal resolution. This paper is intended to present the present status at AIM on such technologies. High speed MCT MWIR devices with 3.4-5μm spectral band and 256 * 256 pixels in a 40μm pitch are designed to provide > 800Hz full frame rate with pixel rates as high as 80Mpixels/s. In case of the dual color device, the MWIR is split into a 3.4-4.2μm and 4.2-5.1μm section. The device is done with 192 * 192 pixels in a 56μm pitch. The read out circuit is designed to read while scan in a flash integration mode to allow nearly full frame integration for low NETD at high frame rate. A miniaturized command and control electronics with 14 Bit deep digital serial output provides state of the art interfaces. Pro's and cons of spectral selective detection with either temporal coincidence of the different colors or in a sequential mode with smaller pitch, better fill factor and the ability to use the wide band image for visualization and specific image processing algorithms are discussed. In any case, the high frame rate of the 2 devices puts a new standard for seeker head or missile approach warning (MAW) applications. The 3.4-5μm devices exhibit excellent thermal resolution with NETD<10mK @F/2, 1ms. In case of the dual color devices results on electrooptical performance are discussed together with details of the spectral cross talk encountered for 2 colors and its impact on maw performance. A dual band detector combining MWIR and LWIR detection in each pixel is presently under development. This device is done in quantum well (QWIP) technology. The design goal and features of this new device are discussed together with typical applications.