Influence of combined metal Ni + Au resist on properties of connection between devices and PCB

摘要

Incoming term of the lead removing from the soldering process in production of electronic devices brings many problems. Except of very often advertised searching of classic SnPb solder replacement it is also necessary implement corrections in the process of PCB production. Here SnPb alloys are exploited like resist for PCB etching. One of SnPb resist replacement is combined metal Ni+Au resist. Ni+Au resist, as well as used SnPb solder replacement, affects final properties of connection between devices and printed circuit boards. Paper dealts with comparing of properties of primary "lead" way of devices mounting to PCB with newer lead-free way, exploiting Ni+Au resist in PCB production. Comparing will be maked for wide-spread mounting process, that is soldering, as well as for alternative way, that is sticking with electrically conductive adhesives.