For industrial implementation of lead-free materials are necessary important changes in process parameters (temperature, tolerances), auxiliary materials (fluxes, pastes) and manufacturing equipment. One of the most important problems of these changes is the warranty of good quality and reliability of electrical joints realized in new, environment -friendly technology. Especially for small electronic enterprises it will be difficult to prove that the product reliability is not lower than before the change. One of the solutions is application of appropriate accelerated test methods. The actual situation in applied methodology of quality evaluation and accelerated tests will be discussed in the paper. Outgoing from general reliability model of electronic interconnections diverse test methods, using different test accelerating factors (temperature changes and thermal shocks, electrical charge and mechanical factors) and involved stresses, are compared. The ideas and discussion of appropriate test stands are presented. The discussions are supported by some preliminary test results obtained in Warsaw University of Technology. Some conclusions concerning practical application of proposed methods for reliability investigations of certain groups of electronic products are given.
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