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First Self-Consistent Thermal Device Simulator

机译:首款自洽热能设备模拟器

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We address the most critical issue in nano devices: degradation due to lattice heating. We give recommendations on the lattice heating for different generations of FD SOI devices ranging between 25 nm and 100 nm channel length. We find that in small devices, due to the velocity overshoot effect lattice heating has less degrading effect on the device electrical characteristics. Silicon on diamond is found to be a better device structure in terms of heat transport. We also consider alternative device technologies, such as dual gate devices and find that lattice heating does not have that much degrading effect compared to the current enhancement that these structures offer.
机译:我们在纳米器件中解决了最关键的问题:由于格子加热导致的降级。我们向不同几代的FD SOI器件的晶格加热提出建议,范围在25nm和100nm沟道长度之间。我们发现,在小型设备中,由于速度过冲效果格子加热对器件电气特性的影响较低。在热传输方面,发现钻石上的硅是更好的装置结构。我们还考虑替代设备技术,例如双栅极设备,并发现与这些结构提供的电流增强相比,格子加热不具有这种劣化的效果。

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