Approaches to high pin count and high power surface mount packages

摘要

Recent VLSI devices for consumer product require packages with high pin count (more than 200 I/Os) and/or high power dissipation (over two watts) capability. The authors review various approaches to address these requirements with emphasis on surface mount packages. Furthermore, for portable consumer products such as digital cellular telephones, notebook computers or video cameras, thin and light packages are preferred. Plastic pad array carrier (PAC) are also described in order to achieve high frequency SMTs.