Electronic Composites :Overview with two case studies, thermal interface materials and active composites

摘要

The subject of electronic composites has attracted stronger attention among the researchers on composites and composite structures which require multi-functionality such as electromagnetic and optical properties. My talk is aimed at recent advances on modeling and processing of selected electronic composites: (1) thermal interface materials(TIM) a key interconnect material for thermal management of electronic packaging in both chips and pumped laser diodes, (2) active composites that can sense and actuate under themo-mechano-electromagnetic loading. Both materials, use of accurate modeling that can bridge the nano-micro-structure and macroproperties of the composite is a key design step in identifying the optimum their nanostructure and microstructure before proceeding their processing.