Functional Layers and Elements in Printed Circuit Boards

摘要

A novel approach for implementing functional layers in printed circuit boards has been proposed. This approach is especially of interest for small and medium production runs of approx. up to 10~6 components per year, as it is very cheap and easily accessible. It combines function (here motion detection), protection (housing) against environmental impacts and signal redistribution. Furthermore it can be processed automatically on SMD pick and place machines. The reliability of the manufacturing process has been demonstrated by producing and testing more than 2*10~5 switches so far. Future developments will address the behaviour of additional functional layers in printed circuit boards like fluidic and optical layers.