During the past few years X-ray Test and Inspection has become a major part in the Quality control of Microelectronics and Semiconductor Industry. Advances both in X-ray tube technology and in X-ray detector technology have been made. Radioscopy has expanded and has established in many new fields that require quality control or process optimization. First nanofocus and multifocus X-ray systems have become available with a focus spot of .5 micron. In the existing range of micro focus X-ray tubes further improvements have been achieved as well, like increased long term stability of intensity position constancy. This presentation illustrates numerous examples and applications where new X-ray components have been beneficially used in the Failure Analysis and Process Control of Microelectronics, Semiconductor components and PCB's.
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