This paper provides an overview of new applications for chemical mechanical polishing (CMP) on novel materials and devices. Historically, the "traditional" applications of CMP have been focused around process steps in the manufacturing of CMOS devises: interlevel dielectric (ILD) planarization, tungsten CMP for contacts or vias, shallow trench isolation (STI), and copper damascene for advanced interconnects. These are the processes that account for the vast majority of CMP currently performed in fabs around the world. However, a large number of new materials and new applications are in development or ramping into production which also utilize CMP to achieve the performance they need. These applications represent emerging growth areas and often hold significant technical challenges for the process and integration teams working on them.
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