首页> 外文会议>International symposium on hydrometallurgy >DETERMINATION OF CRYSTALLITE SIZE AND SURFACE ROUGHNESS OF COPPER DEPOSITS FOR ELECTROWINNING IN THE PRESENCE OF AN ORGANIC ADDITIVE
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DETERMINATION OF CRYSTALLITE SIZE AND SURFACE ROUGHNESS OF COPPER DEPOSITS FOR ELECTROWINNING IN THE PRESENCE OF AN ORGANIC ADDITIVE

机译:在有机添加剂存在下电解铜沉积物的微晶尺寸和表面粗糙度的测定

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The crystallite size of copper electrodeposits was determined by X-Ray powder diffraction analysis using a General Area Detector Diffraction Solution (GADDS) diffractometer. Crystallite size was calculated for copper thin films which were deposited on a 316 stainless steel rotating cylinder electrode (RCE) in the presence and absence of additive "A". The crystallite size was calculated from a corrected full width at half maximum (FWHM) of the [110] peak profile using the Scherrer equation. The test of significant difference on crystallite size was derived using Kruskal-Wallis method. It was found that in the absence of the additive the median crystallite size was 426A, which decreased to 364. in the presence of the additive. As the additive degraded, the crystallite size increased to a size similar to that observed in the absence of additive.
机译:通过使用一般区域检测器衍射溶液(GADDS)衍射仪通过X射线粉末衍射分析测定铜电沉积物的微晶尺寸。计算铜薄膜的微晶尺寸,该铜薄膜在存在和不存在添加剂“a”的情况下沉积在316不锈钢旋转缸电极(RCE)上。使用Scherrer方程,从[110]峰值峰值的校正全宽度从校正的全宽计算晶状体尺寸。使用Kruskal-Wallis方法来衍生微晶尺寸差异的试验。发现在没有添加剂的情况下,中值微晶尺寸为426A,其降低至364.在添加剂存在下。随着添加剂降解,微晶尺寸增加到在不存在添加剂时观察到的尺寸。

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