Determination of the Interfacial Fracture Toughness of Laminated Silicon Die on Adhesive Dicing Tape from Stud Pull Measurement

摘要

Stud pull measurements have been conducted to obtain the normal forces required to detach die attach film (DAF) laminated dice from UV dicing tapes. The DAF is commonly used as bonding media for thin die attach process. Peak normal forces required to pull the laminated dice apart are obtained from the measurement for various DAFs and adhesive dicing tapes at different temperatures. We construct a FEM model by using ABAQUS for given configuration. The applied J-integrals are calculated under the same loading conditions as in experimental set up. The result of the FEM analysis helps us to interpret the force signal obtained in stud pull measurement. Scaling rules are developed from the numerical results of the FEM model to determine the applied J-integral for any die size by using a reference curve. We use these scaling rules and the peak normal force obtained from stud pull measurement to estimate the critical applied J-integral and the fracture toughness of the interface between DAF laminated dice and adhesive dicing tapes for given samples.