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Free-standing HVPE-GaN Layers

机译:free-standing HV PE-Gan layers

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摘要

We have grown GaN layers with a thickness up to 340 μm in an rf-heated vertical HVPE reactor with a bottom-fed design. The GaN layers were separated from the sapphire substrate by a LLO process. The free-standing GaN was investigated by HRXRD, AFM and low temperature CL. The FWHM values of the ω-scans are 96 and 129 arcsec for the (104) and (002) reflection, respectively, which indicates high crystalline quality. The c and a lattice parameters are determined as c = 0.51850 +- 0.00004 nm and a = 0.31890 +- 0.00004 nm, indicating stress free material. The etch pit density was estimated to be 1 x 10~7 cm~(-2). The used HVPE growth procedure together with the subsequent LLO are obviously capable to provide high-quality free-standing GaN material for further epitaxial overgrowth.
机译:在RF加热的垂直HVPE反应器中,我们已经在厚度为340μm的GaN层,其具有底部喂养的设计。通过LLO工艺将GaN层与蓝宝石衬底分离。通过HRXRD,AFM和低温Cl研究了独立的GaN。 ω-扫描的FWHM值分别为(104)和(002)反射的96和129弧度,其表示高晶体质量。 C和晶格参数被确定为C = 0.51850±0.00004nm和A = 0.31890 + - 0.00004nm,表示有压力材料。估计蚀刻坑密度为1×10〜7cm〜(-2)。使用过的HVPE生长过程与随后的LLO显然能够为进一步外延过度生长提供高质量的独立GAN材料。

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