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Carrier Concentration Control of GaSb/GaInAsSb System

机译:Gasb / Gainassb系统的载体浓度控制

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The residual carrier concentration of GaSb and GaSb-lattice matched Ga1-xInxAsySb1-y alloys (x = 0.12-0.26; y = 0.9x) grown by liquid phase epitaxy (LPE) and molecular beam epitaxy (MBE) was studied as a function of growth temperature, V/III ratio and alloy composition. Typical carrier concentrations p similar to 2-3x10(16) cm(-3) were obtained for undoped GaSb grown by MBE at 480 degrees C, by LPE from Ga-rich melt at low temperature (400 degrees C), and by LPE from Sb-rich melts at similar to 600 degrees C, The native acceptor defect responsible of the high p-type residual doping in GaSb is reduced when the indium concentration, is increased, and disappears for indium rich alloys (x = 0.23, 0.26). Tellurium compensation was used for controlled n-type doping in the (0.05-30)x10(17) cm(-3) range. A maximum of free carrier concentration was 1.5x10(18) cm(-3) for LPE layers, 2x10(18) cm(-3) for MBE layers grown at 1.0 mu m/h, 3.5x10(18) cm(-3) for MBE layers grown at 0.2 mu m/h. SIMS measurements showed Te concentrations of more than 1020 at/cm(3), suggesting the formation of ternary GaSb1-xTex solid solution.
机译:通过液相外延(LPE)和分子束外延(MBE)研究了液相外延(LPE)和分子束外延(MBE)生长的Ga1-Xinxasysb1-Y合金(x = 0.12-0.26; y = 0.9×)的残留载流子浓度生长温度,V / III比和合金组合物。典型的载体浓度P类似于2-3x10(16)厘米(-3),用于在低温(400℃)的Ga-Rich熔体中以480c℃下由480℃加长的未掺杂的气体,并通过LPE富含Sb的熔体类似于600摄氏度,当铟浓度增加时,对气体高p型残余掺杂的原生受体缺损减少,并且对于富含富含铟合金(x = 0.23,0.26)消失。碲补偿用于(0.05-30)X10(17)cm(-3)范围内的受控N型掺杂。对于LPE层,最大的游离载体浓度为1.5×10(18 )cm(-3),用于以1.0μm/ h,3.5x10(18)cm(-3)生长的MBE层2×10(18)cm(-3)。 )对于以0.2μm/ h种植的MbE层。 SIMS测量显示TE浓度大于1020 AT / cm(3),表明三元加气体固体溶液的形成。

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