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Deformation Behavior of 7075Al/SICP Composite During Multi- Pass Deformation at High temperatures

机译:高温多通变形期间7075Al / SICP复合物的变形行为

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Hot deformation behavior of 7075 aluminum alloy containing 15 vol % of SiC particles (average size of 14 micron) and the monolithic alloy was studied at 300 and 400°C at constant strain rate of ls~(-1) under uniaxial compression. The results showed that the fractional softening (FS) increased in both reinforced and monolithic alloys when the deformation temperature increased from 300 to 400°C, but monolithic alloy showed a slightly higher FS compared to composite under identical deformation conditions. TEM examination revealed that the monolithic alloy and composite contained almost similar substructures after either single or double pass deformation at a given temperature irrespective of interpass hold time. Subgrain growth was observed in these materials during holding after deformation at 400°C, but such grain growth did not occur at 300°C. The structural study showed that static recrystallization did not occur in these materials during hold time between passes, and the fractional softening occurs mainly due to static recovery.
机译:在单轴压缩下,在300和400℃下,在单轴压缩下,在300和400℃下,在LS〜(1)的恒定应变速率下,在300和400℃下研究了含有15Vol%的SiC颗粒(平均尺寸的SiC颗粒的铝合金(平均尺寸为14微米)和整体型合金。结果表明,当变形温度从300至400℃增加时,增强和整体合金的分数软化(FS)增加,但在相同的变形条件下,单片合金显示出稍高的Fs略高。 TEM检查表明,在给定温度下单个或双通变形之后,单片合金和复合材料在给定温度下无论是HETLAPLET时间如何,在给定温度下都有几乎相似的子结构。在在400℃的变形后保持在这些材料中在这些材料中观察到粒细胞生长,但在300℃下不会发生这种晶粒生长。结构研究表明,在通过在通过之间的保持时间期间不会发生静态重结晶,并且分数软化主要是由于静态恢复。

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