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Hot Deformation mechanisms in 7075Al/10%SiCp metal matrix composites

机译:7075Al / 10%SiCp金属基复合材料的热变形机理

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The high-temperature deformation behavior of Al 7075/SiCp Composites was investigated by carrying out compression tests for determination of the optimum hot deformation conditions. The tests were carried out in the temperature range of 300 - 500℃ and strain rates ranging from 0.001 - 1.0 s~(-1) with a height reduction of 50%. The optimum hot-working conditions were decided from the processing map based on the dynamic materials model (DMM). Dynamic recrystallization (DRX) occurred over the entire temperature and strain rate range. However, uniformly sized grains were formed at the temperature range of 300 - 500℃ and strain rate range of 0.001- 0.01 s~(-1), which are the optimum condition for hot working of this material. The characteristic microstructures predicted from the processing map agreed well with the results of microstructural observations.
机译:通过进行压缩试验以确定最佳的热变形条件,研究了Al 7075 / SiCp复合材料的高温变形行为。试验在300-500℃的温度范围内进行,应变速率为0.001-1.0 s〜(-1),高度降低了50%。根据动态材料模型(DMM)从加工图确定最佳热加工条件。动态再结晶(DRX)在整个温度和应变速率范围内发生。然而,在300-500℃的温度范围和0.001-0.01 s〜(-1)的应变速率范围内会形成均匀尺寸的晶粒,这是该材料热加工的最佳条件。从加工图预测的特征微结构与微结构观察结果非常吻合。

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