Micro-Drilling of PCB Substrate Using DPSS 3rd Harmonic Laser

摘要

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of through and blind hole in Cu/PI/Cu substrate with the UV DPSSL and a scanning device is investigated by both experimental and numerical methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the multi path for through hole with high energy density and we use Archimedes spiral path for blind hole with different energy densities to ablate different material. Furthermore, Matlab simulations considering the energy threshold of material is performed to anticipate the ablation shape according to the duplication of pulse, and FEM thermal analysis is used to predict the ablation depth of copper. This study would be widely applicable to various laser micromachining applications including through and blind hole micro-drilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzles amongst others.