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Electroless deposition of silver onto alumina substrates

机译:银在氧化铝基材上的沉积银

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Silver has the highest electrical conductivity of all metals and consequently this property is an attractive feature which makes it a leading candidate for use in electronic devices. The research conducted was focused primarily on the developmentof a process for obtaining a deposited silver-coating onto alumina, for applications related to electrical-conducting devices arid, ancillarily, catalysts. Alumina balls and plane substrates were utilized for the investigation. The coating processemployed an aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives - an activator which would be expected to promote good deposition-characteristics onto the (dielectric) substrate and aninhibitor which would obviate homogeneous reduction (precipitation) of silver was observed when the activator-containing silver-electrolyte reductant constituents were combined. However, the silver-electrolyte/reductant system with inhibitor could beemployed (at 800C) to achieve a viable (subject to future research optimization) coating on alumina. The influence of the processing temperature on the deposition process was delineated during the course of the research. The morphology of thedeposited-silver on the alumina balls was assessed by SEM imaging. A tape-peel test was employed, with the plane substrates, to semi-quantitatively characterize the adhesion to the alumina.
机译:银具有所有金属的最高电导率,因此该属性是一个有吸引力的特征,使其成为电子设备中使用的主要候选者。所进行的研究主要集中在制导下,用于将沉积的银涂层涂覆到氧化铝上,用于与导电装置干旱,携带副,催化剂的应用。氧化铝球和平面衬底用于调查。涂层处理氨基氨基银 - 硝酸盐电解质,用甲醛溶液作为还原剂。改性添加剂 - 当组合含有活化剂的银电解质还原剂成分时,观察到将促进在(电介质)衬底和呼吸均匀减少(沉淀)上的良好沉积特性的活化剂。然而,具有抑制剂的银电解质/还原剂系统可以播放(在800℃)中,实现氧化铝上的可行性(受未来的研究优化)涂层。在研究过程中,在研究过程中描绘了加工温度对沉积过程的影响。通过SEM成像评估了氧化铝球上的氧化银的形态。使用平面衬底,使用胶带剥离试验,以半定量表征对氧化铝的粘附性。

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