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Improved distributed model for capacitors in high-performance packages

机译:改进的高性能封装电容器的分布式模型

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Time-domain and frequency-domain measurements show that a simple lumped RLC model for a multilayer ceramic capacitor is inadequate, overestimating high-frequency impedance by a factor of five. A lossy transmission-line model works better, and is improved by placing incremental resistance in series with the incremental capacitance. Refinements of this model are developed based on time-domain step-response measurements and on frequency-domain impedance measurements. Better packaging to reduce series inductance is discussed.
机译:时域和频域测量表明,多层陶瓷电容器的简单集总型RLC模型不足,高估高频阻抗五倍。损耗的传输线模型更好地工作,通过将串联的增量电阻与增量电容串联进行增量电阻来改进。该模型的改进基于时域步响应测量和频域阻抗测量来开发。讨论了更好的包装以减少串联电感。

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