High Value Thin Wafer Support Technology for 3DIC

摘要

As the 3DIC market matures, more is understood about the technical and cost challenges. At the 2013 Semicon-West gathering, a panel of global experts identified these technical challenges to represent some of the most significant barriers to the industry's efforts to maintain progress with Moore's Law. Searching and achieving high value manufacturing of 3DIC devices requires wrestling with several technologies and processes, all which may assert a different value for the manufacturer. Current technologies for thin wafer support use a wide range of adhesives applied to the device wafer, bonded to a carrier, backside processed, and de-bonded by an array of methods. Daetec has been investigating temporary bonding for nearly 15yrs, is producing a range of products for semiconductor (e.g. WaferBond (Brewer-Science, Inc.)), and for the display market using a low-cost tunable adhesion-force material that is peeled by simple means. Daetec has developed a new technology, DaeBond 3D, allowing de-bonding to occur in a batch process while thinned wafers are affixed to film frames. This new approach provides a shift in conventional practice. Our paper presents several temporary bonding options with DaeBond 3D in an effort to define value-added approaches for thin wafer handling.