Solution for HVM TSV Etch Process

摘要

As the industry is getting their hands around processes critical to cost-effective and reliable TSV manufacturing a key enabler is process control through inspection and metrology. In working with the industry, Rudolph has developed a suite of solutions that incorporate inspection, metrology and software enabling rapid yield ramp. The solution set apply all the way from via etch to CMP, RLD, micro-bumping and all the way to Chip on Wafer mount and post-saw. Within the TSV process a challenging inspection is that of detecting defects after CMP and nail reveal. The bonded wafers are warped, there are no alignment fiducials and the resolution requirement is high. Rudolph has developed a specific solution designed to address the nail reveal defectivity issue.