首页> 外文会议>Capacitor and resistor technology symposium >Study of Copper Powder Composition of the Paste for Termination Electrode
【24h】

Study of Copper Powder Composition of the Paste for Termination Electrode

机译:终端电极浆料铜粉组合物研究

获取原文

摘要

The uniform and thin film was required without crack for end termination without crack. The paste required proper viscosity and rheological properties for plate-dipping, belt-dipping process. In this study, we discussed the film appearance, paste viscosity and resistivity with the size of flake and /or powders and flake aspect ratio. As the result, it was found the most important to obtain dense, uniform and thin termination was usage of was using high dispersed flake to obtain dense, uniform and thin termination. The viscosity of wide distribution with large size of copper powder (MA-CF, MA-CF(E)) was higher than YP series (almost same specific surface area) at same concentration of copper powder. It was difficult to obtain high concentration paste with broad distribution copper powder (MA-CF, MA-CF(E)). It was able to prepare high concentration paste and dense film with YP series. The viscosity of the paste depends on size particle and flake aspect ratio.
机译:需要均匀和薄膜而无需裂缝而无需裂纹。糊剂需要适当的粘度和流变性能,用于板浸,皮带浸渍过程。在这项研究中,我们讨论了薄膜外观,糊状粘度和电阻率,薄片和/或粉末和薄纤维纵横比。结果,发现获得致密,均匀和薄的终端最重要的是使用高分散的薄片来获得致密,均匀和薄的终端。具有大尺寸铜粉(MA-CF,MA-CF(E))的宽分布的粘度高于铜粉末的YP系列(几乎相同的比表面积)。难以获得具有宽铜粉(MA-CF,MA-CF(E))的高浓度糊状物。它能够用YP系列制备高浓度糊和致密膜。糊状物的粘度取决于尺寸粒子和薄片纵横比。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号