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Copper powder, method for producing the same, copper paste using the copper powder, copper paint, electrode

机译:铜粉,其制造方法,使用该铜粉的铜浆,铜涂料,电极

摘要

PPROBLEM TO BE SOLVED: To provide a copper powder used for an electrode in a capacitor or the like, which has improved oxidation resistance. PSOLUTION: This copper powder has the surface of a copper particle modified with 0.1-20 wt.% sulfur compounds such as mercaptopropionate, dodecanthiol, hexanethiol, methyl thioglycolate, ethyl thioglycolate and cysteine. The method for producing such a copper powder comprises, for instance, reacting a copper compound with a reducing agent in a medium to obtain copper particles, and subsequently contacting the obtained copper particles with a sulfur compound to modify the surface of the copper particles with the sulfur compound. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:提供用于电容器等中的电极的铜粉,该铜粉具有改善的抗氧化性。

解决方案:该铜粉的表面具有0.1-20 wt%的硫化合物(如巯基丙酸酯,十二烷硫醇,己硫醇,硫代乙醇酸甲酯,硫代乙醇酸乙酯和半胱氨酸)改性的铜颗粒表面。制备这种铜粉的方法包括,例如,使铜化合物与还原剂在介质中反应以获得铜颗粒,然后使所获得的铜颗粒与硫化合物接触以使铜颗粒的表面改性。硫化合物。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4252349B2

    专利类型

  • 公开/公告日2009-04-08

    原文格式PDF

  • 申请/专利权人 石原産業株式会社;

    申请/专利号JP20030108106

  • 发明设计人 友成 雅則;

    申请日2003-04-11

  • 分类号B22F1/02;B22F1;B22F9/20;C23C22/52;H01B1;H01B1/22;H01B13;H01G4/008;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:27

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