首页> 外文会议>Capacitor and resistor technology symposium >A Development Methodology for Copper End Termination Paste-Part 2: Defects in Fired Termination
【24h】

A Development Methodology for Copper End Termination Paste-Part 2: Defects in Fired Termination

机译:铜端终止浆料的开发方法 - 第2部分:射击终止的缺陷

获取原文

摘要

Copper-based pastes have emerged as end termination material of choice for ceramic capacitors with base metal internal electrode. The necessity to sinter the termination in nitrogen atmosphere puts restriction on raw material selection of the paste. Effect of raw materials and the paste properties on the green cosmetic defects were described in an earlier paper. In this paper, general approaches to eliminate sintering related defects such as porosity, blisters, termination lift-off, glassing etc. are described. Finally, properties of an optimized copper termination, which can be processed between 800-825°C, are discussed.
机译:铜浆料已成为具有基础金属内部电极的陶瓷电容器的最终端接材料。烧结氮气氛中终止的必要性对浆料的原料选择限制。在早期的纸上描述了原料和糊状物质对绿色化妆品缺陷的影响。在本文中,描述了消除烧结相关缺陷的一般方法,例如孔隙率,水疱,终端,抬起,玻璃等。最后,讨论了可以在800-825℃之间处理的优化铜终端的性质。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号