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A Development Methodology for Copper End Termination Paste — Part 1: Origin of Green Defects

机译:铜端接膏的开发方法论—第1部分:绿色缺陷的起源

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摘要

Copper (Cu) based pastes have emerged as the termination materials of choice for ceramic capacitors with base metal internal electrodes. To prevent oxidation of nickel (Ni) internal electrode and the copper terminations, it is necessary to fire the terminations in a nitrogen atmosphere. This requirement places significant restrictions on raw materialselection for the termination pastes. For example, acrylic-based resins are used as organic binder for their clean burning characteristics over the traditional ethyl cellulose based binder system. As the viscoelastic behavior of acrylic resin systems are different to those of cellulose systems, differences are observed in the flow behavior of the paste. In this paper, the influence of paste rheology on the green cosmetic defects such as mooning, peaking,etc. is discussed. Additionally, the influence of process condition such as dipping parameters, drying conditions etc., on the green cosmetic defects are discussed. Finally, properties of a copper termination, which can be processed between 800–825°C, are discussed.
机译:铜(Cu)基浆料已成为具有贱金属内部电极的陶瓷电容器的首选端接材料。为了防止镍(Ni)内部电极和铜端子的氧化,必须在氮气氛中烧制端子。该要求对端接膏的原材料选择施加了很大的限制。例如,丙烯酸酯基树脂由于其比传统的乙基纤维素基粘结剂体系更清洁的燃烧特性而被用作有机粘结剂。由于丙烯酸树脂体系的粘弹行为与纤维素体系不同,因此在糊料的流动行为中观察到差异。本文研究了糊状流变学对绿色化妆品缺陷的影响,如变色,峰化等。讨论。此外,还讨论了诸如浸渍参数,干燥条件等工艺条件对绿色化妆品缺陷的影响。最后,讨论了可以在800–825°C之间进行处理的铜端子的性能。

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