As I/O pins increase in the LSI, Print Circuit Boards (PCBs) makes rapid progress of high-density packaging technology involving plastic packages, multi-layer boards, build-up technology. And associated micro-drilling technology has been much attention to achieve the design targets of higher density, higher quality level and lower cost. In view of these trends, micro-drilling technology using lasers has gained an increase in popularity. Today, with the progress of laser systems and the development of processing methods, the laser drilling technology for glass epoxy FR-4 is being evaluated. However, the ordinary glass fabric epoxy FR-4 has poor drilling ability due to the material non-uniformity in the laminates, and the requirement for improvement has been increased. We developed new type glass fabrics (MS fabrics), whose fibers are uniformly distributed in the laminate so as to satisfy the requirement of homogeneity. The laminates using the newly developed glass fabrics were proven that the micro-diameter drilling, that is laser drilling for 0.1mm diameter or less, could produce uniform drill holes.
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