Development of wafer-scale cooling/heating thermoelectric arrays using thin-film superlattice devices

摘要

Thin-film superlattice thermoelectric material was used to fabricate 2-inch wafer scale thermoelectric module arrays. These arrays employ a promising thermoelectric device technology that exhibits a significant enhancement in the thermoelectric device figure of merit (ZT) at 300 K, cooling/heating power densities in excess of 100 Watts/cm{sup}2 and response times significantly faster than bulk devices. To power and characterize these devices, we have developed a high-speed computer controlled multi-channel power supply with integrated real-time infrared imaging. This system allows creation of individual temperature control profiles, and exploits the rapid response time of the thin-film device. Using this system, we demonstrate high-speed operation and compare the response times of bulk and thin-film devices in the same format. Finally, applications of thin-film thermoelectric arrays are considered.