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Thermoelectric characteristics of Si/Ge superlattice thin film at low temperature

机译:低温下Si / Ge超晶格薄膜的热电特性

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We have been studied thermoelectric characteristics of Si / (Au-doped Ge) superlattice thin films at temperatures from room temperature (RT) to low temperatures less than 100 K and compared these to those of Si and (Au + Ge) alloy thin film. In the Si / (Ge + Au) superlattice aner heating process, the electric resistivity decreased at all temperature. This annealed Si / (Ge+Au) superlattice showed the high thermoelectric power of 105 μV/K at 290 K, compared with the unannealed Si / (Ge+Au) or the alloy film. At temperatures less than 200 K, however, the thermoelectric power of the unannealed Si / (Ge+Au) switched polarities from positive to negative and reached -4.6 mV/K at 80 K. This large negative thermoelectric power at low temperature was not observed in the annealed Si / (Ge+Au) or the alloy film. On the other hand, magnetic field characteristics of all samples showed no effect at 100 K, 200 K or 290 K. This was explained using the two-band parabolic model calculation, assuming that a large amount of Au-doping caused a very low carrier mobility.
机译:我们已经在室温(RT)的温度下研究了Si /(Au-掺杂Ge)超晶格薄膜的热电特性,低于100k的低温,并将其与Si和(Au + Ge)合金薄膜的温度相比。在Si /(Ge + Au)超晶格aner加热过程中,电阻率在所有温度下降。该退火的Si /(Ge + Au)超晶格与未能发病的Si /(Ge + Au)或合金膜相比,在290 k下显示出105μV/ k的高热电功率。然而,在低于200 k的温度下,未发后的Si /(Ge + Au)的热电力从正为负,达到-4.6mV / k处的切换极性,在80k下达到-4.6mV / k.该低温下的这种大的负热电功率未观察到在退火的Si /(Ge + Au)或合金膜中。另一方面,所有样品的磁场特征在100k,200k或290k时显示出效果。这是使用双频抛物面模型计算来解释的,假设大量的au-掺杂导致非常低的载体移动性。

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