Patterning 180 nm copper-oxide dual damascen baseline with 193 nm resists

摘要

At Advanced Tool Development Facility, 193 nm resist is being used to transition to the patterning for 180 nm node. This paper describes the process development for 180 nm node copper oxide dual damascene structures with 193 nm resists. The yield has been compared with 250 nm copper-oxide dual damascene baseline. In addition, an example of yield issue is described.