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Growth Mechanism and Threshold of Mode II and Mode III Fatigue Crack

机译:模式II和模式III疲劳裂纹的生长机制和阈值

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In order to make clear the relationship between ΔK{sub}(IIth) and ΔK{sub}(IIIth) and the influence of the rolling texture, Mode II and Mode III fatigue crack growth tests were carried out for annealed 0.47% carbon steels (JIS S45C). The values of ΔK{sub}(IIth) (9.5 Mpa√m and 9.7 Mpa√m) for crack growth normal to the rolling direction were higher than the values of ΔK{sub}(IIth) (8.8 Mpa√m and 8.1 Mpa√m) for crack growth parallel to the rolling direction. Mode II and Mode III fatigue crack growth produced darkly etched microstructural layers in the vicinity of Mode II and Mode III fatigue crack. Vickers hardness of the layers was much higher than that of the original matrix (Mode II: HV 164 → HV 468. Mode III: HV 175 → HV 678). The layers consisted of very fine grains with the size ranging from 100 to 200 nm. The value of ΔK{sub}(IIth) was approximately equal to ΔK{sub}(IIIth), i.e. ΔK{sub}(IIth) ≌ ΔK{sub}(IIIth) ≌ 9.6 Mpa√m for crack growth perpendicular to rolling direction. Therefore, the mechanism of Mode II fatigue crack growth is presumed to be essentially identical to that of Mode III fatigue crack growth.
机译:为了清除ΔK{sub}(IITH)和ΔK{sub}(iih)之间的关系以及滚动纹理的影响,模式II和模式III疲劳裂纹生长试验进行退火0.47%碳钢( JIS S45C)。 ΔK{sub}(IITH)(9.5mPa√m和9.7mpa√m)的值垂直于滚动方向的裂缝生长的值高于Δk{sub}(IITH)的值(8.8mpa√m和8.1 mpa √m)对于平行于滚动方向的裂缝增长。模式II和模式III疲劳裂纹生长产生了模式II和模式III疲劳裂纹附近的暗蚀刻的微观结构层。层的维氏硬度远高于原始矩阵的硬度(模式II:HV 164→HV 468.模式III:HV 175→HV 678)。这些层由非常精细的晶粒组成,尺寸范围为100至200nm。 ΔK{sub}(IITH)的值大致等于ΔK{sub}(IEITH),即Δk{sub}(iith)≌Δk{sub}(iiith)≌9.6mpa√m,用于垂直于滚动方向的裂纹生长。因此,推测模式II疲劳裂纹裂纹生长的机制基本上与模式III疲劳裂纹裂纹生长基本相同。

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