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Growth Mechanism and Threshold of Mode II and Mode III Fatigue Crack

机译:模式II和模式III疲劳裂纹的生长机制和阈值

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In order to make clear the relationship between Δ K_(Ⅱth) and Δ K_(Ⅲth) and the influence of the rolling texture, Mode Ⅱ and Mode Ⅲ fatigue crack growth tests were carried out for annealed 0.47 % carbon steels (JIS S45C).The values of ΔK_(Ⅱth) (9.5 MPa m~(1/2) and 9.7 MPa m~(1/2) ) for crack growth normal to the rolling direction were higher than the values of ΔK_(Ⅱth) (8.8 MPa m~(1/2) and 8.1 MPa m~(1/2) ) for crack growth parallel to the rolling direction. Mode Ⅱ and Mode Ⅲ fatigue crack growth produced darkly etched microstructural layers in the vicinity of Mode Ⅱ and Mode Ⅲ fatigue crack. Vickers hardness of the layers was much higher than that of the original matrix (Mode II: HV 164 → HV 468. Mode Ⅲ: HV 175 → HV 678). The layers consisted of very fine grains with the size ranging from 100 to 200 nm. The value of ΔK_(Ⅱth) was approximately equal to ΔK_(Ⅲth), i.e. ΔK_(Ⅱth)≈ΔK_(Ⅲth)≈9.6 MPam~(1/2) for crack growth perpendicular to rolling direction. Therefore, the mechanism of Mode Ⅱ fatigue crack growth is presumed to be essentially identical to that of Mode Ⅲ fatigue crack growth.
机译:为了清除δk_(Ⅱ)和δk_(Ⅲ)之间的关系以及滚动纹理的影响,模式Ⅱ和模式Ⅲ疲劳裂纹生长试验进行退火0.47%碳钢(JIS S45C)。 ΔK_(Ⅱ)(9.5MPa m〜(1/2)和9.7MPa m〜(1/2)的值,用于弯曲到滚动方向的裂缝生长高于ΔK_(Ⅱ)的值(8.8MPa m 〜(1/2)和8.1MPa m〜(1/2)),用于平行于滚动方向的裂缝增长。模式Ⅱ和模式Ⅲ型疲劳裂纹生长产生了Ⅱ和模式Ⅲ型疲劳裂纹附近的暗蚀刻微观结构层。层的维氏硬度远高于原矩阵的硬度(模式II:HV 164→HV 468.模式Ⅲ:HV 175→HV 678)。这些层由非常精细的晶粒组成,尺寸范围为100至200nm。 ΔK_(Ⅱ)的值近似等于ΔK_(Ⅲ),即ΔK_(Ⅱ)≈ΔK__(Ⅲ),用于垂直于滚动方向的裂纹生长。因此,推测模式Ⅱ疲劳裂纹裂纹生长的机制与模式Ⅲ疲劳裂纹生长基本相同。

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