首页> 外文会议>IEEE International Workshop on Rapid Systems Prototyping >RAPIDO: a modular, multi-board, heterogeneous multi-processor, PCI bus based prototyping framework for the validation of SOC VLSI designs
【24h】

RAPIDO: a modular, multi-board, heterogeneous multi-processor, PCI bus based prototyping framework for the validation of SOC VLSI designs

机译:RAIDO:模块化,多板,异构多处理器,基于PCI总线的原型设计框架,用于验证SOC VLSI设计

获取原文

摘要

Modern System-on-Chip (Soc) designs are steadily increasing in complexity, while verification strategies, based on traditional logic simulations, are becoming extraordinarily and intolerably slow. On the other side, Rapid System Prototyping frameworks are not yet scalable and modular enough to prototype complex multiprocessor systems. The proposed solution offers a modular approach for the validation of SoCs containing up to 128 heterogeneous processors. The RSP framework is based on a multi-board PCI architecture. An inter-task layered data synchronization protocol has been implemented in order to ease HW-SW partitioning, co-design and design space exploration.
机译:现代体系(SoC)设计在复杂性中稳步增加,而基于传统逻辑模拟的验证策略正在变得非常且不宽地缓慢。在另一边,快速系统原型框架尚未缩放和模块化足以原型复杂多处理器系统。该解决方案提供了模块化方法,用于验证包含多达128个异质处理器的SOC。 RSP框架基于多板PCI架构。已经实现了任务间分层数据同步协议,以便于HW-SW分区,共同设计和设计空间探索。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号