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Mechanical Properties of InAs/InP and InAs(S,Sn)/InP Semiconductor Alloys

机译:INAS / INP和INAS(S,SN)/ INP半导体合金的机械性能

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In this paper, the microindentation studies have been reported for InAs/InP and InAs(S,Sn)/InP semiconductors alloys grown by MOVPE techniques. It is found that the microhardness value increases with increase of applied load and attains a constant value for further increase in the load. The mechanical properties like, fracture toughness, brittleness index, fracture surface energy and indentation size effect coefficient have also been determined using the microhardness value. The indented sample is etched in H_2SO_4:H_2O_2:H_2O in the ratio of (1:1:1) for 30 seconds. This reveals the dislocation rosette patterns generated around the edges of the indentation regions while spherical etch pits are produced on the surface of the sample. The results are discussed in detail.
机译:本文据报道,通过MOVPE技术生长的INAS / INP和INAS(S,SN)/ INP半导体合金的INAS / INP和INP(S,SN)/ INP半导体合金。发现微硬度值随着施加的负载的增加而增加,并达到恒定的恒定值,以进一步增加负载。使用微硬度值也确定了裂缝韧性,脆性指数,断裂表面能和压痕尺寸效应系数的机械性质。缩进样品在H_2SO_4:H_2O_2:H_2O中蚀刻(1:1:1)的比例30秒。这揭示了围绕压痕区域的边缘产生的位错玫瑰花饰图案,同时在样品的表面上产生球形蚀刻凹坑。结果是详细讨论的。

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