Evaluation of 200 mm MPTI floating head with varied consumables

摘要

A high performance polishing is essential to improve the yield and wafer edge exclusion for the Chemical Mechanical Planarization (CMP) processes, especially for the next generation devices. This study is to evaluate the floating head oxide and BPSG CMP performance with varied consumables. The results demonstrate the excellent process performance of this floating head technology that are comparable to or even exceed those from commercial available polish carriers. [1]