Mechanical response of PCBs in portable electronic products during drop impact

摘要

There is a need for more detailed studies on the drop impact reliability of electronic packages, in view of the fact that solder interconnections are becoming smaller, and portable electronic products such as mobile phones can be easily dropped during usage. This paper investigates the mechanical response of printed circuit boards (PCBs) inside portable consumer electronic products, when such products are subjected to drop impact. The response of the PCB is studied because it is one possible factor causing the failure of the interconnections with IC packages. The board response is measured via accelerations and strains at specified locations on the board. The drop test experimental results are consistent with drop orientation and physical structure of the products.