Automatic piek-and-place of 40 microns objects using a robotic platform

摘要

Robotic micro-assembly is one way to manufacture new generation of out of plane and/or hybrid microsystems. This approach requires the study of micromanipulation strategies adapted to the microworld and especially to the surface and adhesion forces. We are focusing our works on the study of robotic assembly methods applied to objects whose size is below 100 micrometers. The handling strategy used is based on a two fingered gripper. In order to reduce the adhesion between the gripper and the manipulated objects specific end-effectors have been developed. Moreover, to improve the release reliability we are using a polymer substrate which induces high adhesion with the object. Some automatic pick-and-places on objects whose typical size is 40 micrometers have been done (cycle time of 1.8 second). There show the reliability of the proposed approach.