LASER DIRECT-WRITE DEPOSITION AND MICROMACHINING FOR FABRICATION OF ELECTRONIC CIRCUITS

机译：激光直接写入沉积和微机械，用于制造电子电路

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1. MesoFab is up and running 2. High volume jobs are already coming through the door 3. MesoFab is fast, flexible, accurate, and highly automated.

机译：1. Mesofab已启动并运行2.大量工作已经通过门3. Mesofab快速，灵活，准确，高度自动化。

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《Digital electronic materials deposition conference》|2002年||共53页
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Michael T. Duignan;
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1. Novel Sensor Fabrication Using Direct-Write Thermal Spray and Precision Laser Micromachining [J] . Q. Chen, T. Tong, J. P. Longtin Journal of manufacturing science and engineering: Transactions of the ASME . 2004,第4期

机译：使用直写式热喷涂和精密激光微加工的新型传感器制造
2. Embedding electronic circuits by laser direct-write [J] . A. Pique, S.A. Mathews, B. Pratap, Microelectronic Engineering . 2006,第11a12期

机译：通过激光直接写入嵌入电子电路
3. Toward All-Carbon Electronics: Fabrication of Graphene-Based Flexible Electronic Circuits and Memory Cards Using Maskless Laser Direct Writing [J] . Jiajie Liang, Yongsheng Chen, Yanfei Xu ACS applied materials & interfaces . 2010,第11期

机译：迈向全碳电子技术：使用无掩模激光直接写入技术制造基于石墨烯的柔性电子电路和存储卡
4. LASER DIRECT-WRITE DEPOSITION AND MICROMACHINING FOR FABRICATION OF ELECTRONIC CIRCUITS [C] . Michael T. Duignan Digital electronic materials deposition conference . 2002

机译：激光直接写入沉积和微机械，用于制造电子电路
5. Design, fabrication and analysis of integrated optical waveguide devices (Laser micromachining, Planar lightguide circuits). [D] . Sikorski, Yuri. 2000

机译：集成光波导设备（激光微加工，平面光导电路）的设计，制造和分析。
6. Low-Power Multimodal Laser Micromachining of Materials for Applications in sub-5 µm Shadow Masks and sub-10 µm Interdigitated Electrodes (IDEs) Fabrication [O] . Cacie Hart, Swaminathan Rajaraman 2020

机译：适用于5 µm以下荫罩和10 µm以下交叉指状电极（IDE）制造中的材料的低功率多模态激光微加工
7. Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017) [O] . Xueyan Sun, Lijing Zhang, Shengyang Tao, 2017

机译：柔性电子产品：一般表面膨胀诱导的化学沉积策略，用于在各种聚合物基板上快速制造铜路电路（ADV。母体。接口14/2017）
8. Fabrication of Gate Array Interconnect Structures Using Direct-Write Deposition Processes [R] . Mitlitsky, F., Whitehead, J. C., Bernhardt, A. F., 1986

机译：利用直写沉积工艺制作门阵列互连结构

LASER DIRECT-WRITE DEPOSITION AND MICROMACHINING FOR FABRICATION OF ELECTRONIC CIRCUITS

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