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New structure 1608 size chip tantalum capacitor -6.3 WV-10 /spl mu/F with face-down terminals for fillet-less surface mounting

机译:新型结构1608尺寸芯片钽电容器-6.3 WV-10 / SPL MU / F带面部底线的表面安装

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This paper introduces the smallest size, 1608 (in mm) size, and the newest series of chip tantalum capacitors having the highest capacitance value in the world at present by means of original new packaging technology and new assembly process. Recent requirements for tantalum chip capacitors from smaller digital mobile equipment, especially Mobile Phone, PDA (Personal Digital Assistant), Pager, DVC (Digital Video Camera), DSC (Digital Still Camera), MD Player (Mini-disk Player), are smaller size and lower profile with higher capacitance. As an answer for those requirements, we have developed 6.3 WV-10 /spl mu/F in 1608 size (L=1.6O mm, W-0.85 mm, t-0.80 mm), which has original new structure by adopting original new process technologies, and has face-down terminals to be available fillet-less surface mounting instead of conventional style, 2012 Size (L=2.0 mm, W=1.25 mm, t=12 mm). The original new process means "Matrix Array Packaging Technology" using matrix lead frame, it means batch molding system instead of individual molding and processing system. 6.3 WV-10 /spl mu/F in conventional style, 2012 size, is a typical item used for digital mobile equipment at present in Japan.; Therefore it is very important in Tantalum Capacitors Industry to develop 6.3 WV-10 /spl mu/F in 1608 Size. Our new structure 1608 size is about three times higher in volumetric efficiency, compared to the conventional style, 2012 size. This item is the smallest in volume and the highest value in capacitance in the world at the present time.
机译:本文介绍了最小尺寸,1608(MM)尺寸,以及目前世界上具有最高电容值的最新系列芯片钽电容器,目前采用原创性新的包装技术和新的装配过程。来自较小数字移动设备的钽芯片电容器的最新要求,尤其是手机,PDA(个人数字助理),寻呼机,DVC(数码摄像机),DSC(数码相机),MD播放器(迷你盘播放器)较小具有较高电容的尺寸和较低的轮廓。作为这些要求的答案,我们在1608尺寸(L = 1.60 mm,W-0.85mm,T-0.80 mm)中开发了6.3 WV-10 / SPL MU / F,通过采用原创新工艺具有原创性新结构技术,并具有面向终端的可用圆角表面安装而不是传统风格,2012尺寸(L = 2.0 mm,W = 1.25 mm,T = 12 mm)。原始的新工艺意味着“矩阵阵列包装技术”使用矩阵引线框架,意味着批量成型系统而不是单独的模制和加工系统。 6.3在传统风格中,2012年尺寸为6.3 WV-10 / SPL MU / F是日本目前的数字移动设备的典型项目。因此,在钽电容器行业中是非常重要的,在1608年以1608尺寸开发6.3 WV-10 / SPL MU / F。与传统风格,2012年尺寸相比,我们的新结构1608尺寸的体积效率大约是体积效率的三倍。此项目是当前世界上最小的体积和最高电容值。

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