CURE MODELING ANALYSIS AND DEVELOPMENT USING COMPUTER AIDED CURING (RAVEN AND WINASCOM)

摘要

The primary objective of this paper is to evaluate current state-of-the-art computer programs to assist in the development of effective cure cycles for a new out-of-autoclave resin. Two composite process modeling programs were investigated, specifically WinASCOM (developed with The McDonnell Aircraft Company under an Air Force contract) and RAVEN (commercially available from the Canadian-based company, Convergent Manufacturing Technology, Inc.). Cure cycle simulations and analyses were performed on the same resin systems and compared to assess their relevant capabilities and accuracy as it pertains to cure process development and refinement. The resin systems evaluated by the programs include the out-of-autoclave epoxy systems: X5320 (experimental version) and Cycom?5320 (commercial version). These are of interest to several customers, including the Non-Autoclave Manufacturing Technology Program, a jointly accomplished program by a Boeing-led team and the U.S. Government (DARPA/DSO) under the guidance of the Air Force. In order for the process modeling programs to perform cure cycle analysis at their highest fidelity, detailed kinetic and viscosity data on both resin systems were collected using dynamic scanning calorimetry (DSC) and rheometric dynamic analysis (RDA) methods via a series of dynamic ramp and isothermal hold conditions. All predictions made by the modeling programs were compared to experimental data obtained by manufacture of test panels using embedded thermocouples and dielectric sensors. Several case studies will be performed for various cure conditions, lay-up thicknesses, and laminate architecture in future work.