A new low temperature curing prepreg

摘要

Mitsubishi Rayon Co. (MRC) has introduced a new low temperature cure material designated as #850. Resin #850 can be cured initially at 80°C and be post-cured at 180°C. It can be used for high temperature applications, because the glass transition temperature of a post-cured #850 laminate is as high as 195°C. #850 is also suitable for molding large scale and complex shaped composite parts. #850 resin system has prepreg out time that is longer than 30 days despite its low temperature cure-ability. #850 prepreg is quite cost effective, because it provides a void free composite by a conventional vacuum bag (only) molding process using a low cost wooden mold. Details of the processing and mechanical and thermal performance of #850 are discussed below.