The research progress of low temperature curing epoxy prepreg was introduced,including the general situation of the low temperature curing prepreg at home and abroad and the modification of the curing agents. The chemical modification of the imidazole curing agent,microcapsule curing agent, hyperbranched compounds and molecular sieve were emphasized. Also the fu-ture development trend and application prospect was also forcast.%主要介绍了长贮存期低温固化环氧树脂基预浸料研究进展,包括国内外低温固化预浸料的概况及固化剂的改性,着重介绍了咪唑类固化剂的化学改性、微胶囊固化剂和超支化化合物及分子筛等方法,并对未来发展趋势和应用前景进行了展望.
展开▼
