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Effects of Physical Properties of Interstitial Material and Mean Nominal Contact Pressure on Behaviors of Thermal Contact Resistance of Contacting Metals

机译:间隙材料物理性质的影响及平均义接触压力对接触金属热接触电阻的行为

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The thermal contact resistance (TCR) or the thermal contact conductance (TCC) plays an important role in cooling of electronic devices with high heat fluxes. In such systems, an interstitial material is often introduced between the heat sink and the heat source. However, heat transfer at the interface with waviness is so complicated that the mechanism has not been elucidated yet. In the present study, for the mean nominal contact pressure p{sub}m ≈ 0.1~0.8MPa, the effects of the thermal conductivity λ and the thickness δ of silicone elastomer and grease on TCC have been investigated experimentally.
机译:热接触电阻(TCR)或热接触电导(TCC)在具有高热量通量的电子器件的冷却中起重要作用。在这种系统中,通常在散热器和热源之间引入间隙材料。然而,具有波纹的界面处的热传递如此复杂,使得该机构尚未阐明。在本研究中,对于平均标称接触压力p {sub}m≈0.1〜0.8mpa,实验研究了导热率λ和硅氧烷弹性体的厚度δ和TCC上的润滑脂的效果。

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