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Development of high current power supply for electroplating

机译:电镀高电流电源的开发

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This paper describes the development of high current (up to 2500A) and low voltage(up to 12V) SMPS unit for electroplating. A special topology and structure of the inverter-transformer was developed. In such manner, the leakage inductance, shin effect and proximity effect of the transformer was greatly reduced. Based on the it, a 5000A/12V power supply was built by two units.
机译:本文介绍了高电流(最多2500A)和低电压(最多12V)SMPS单元的开发。开发了逆变器变压器的特殊拓扑结构和结构。以这种方式,变压器的泄漏电感,闪亮效应和接近效果大大降低。基于此,两个单元建造了5000A / 12V电源。

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