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Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

机译:十七世纪IEEE / CPMT国际电子制造技术研讨会。 “制造技术 - 当前和未来”

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The following topics were dealt with: manufacturing management; modeling, diagnostics and control; high-density interconnects; product integrity; scheduling methodologies; intelligent manufacturing neural networks; environmentally conscientious manufacturing; semiconductor minifabs; flip chip technology; fine pitch bonding, ultra small packages and assembly; soldering; statistical methods; ball grid array packages; design for manufacturing.
机译:处理以下主题:制造管理;建模,诊断和控制;高密度互连;产品完整性;调度方法;智能制造神经网络;环境尽力制造;半导体minifabs;倒装芯片技术;细间距粘合,超小包装和组装;焊接;统计方法;球栅栏阵列包;制造设计。

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