W-CMP Alignment using ASML's ATHENA System on an I-line Stepper

摘要

This paper demonstrates the overlay capability of ASML's ATHENA alignment system on I-line steppers for W-CMP processes. The evaluation presents the method used to find the best scribe-line marks, alignment recipe and the long term overlay capability of ATHENA for a 0.35μm device in a production environment. This alignment capability for W-CMP meets the overlay requirement for the 0.35μm process and thus leads to device yield improvement.